The 1st India Semiconductor and Packaging Ecosystem Conference (ISPEC) commenced its proceedings on February 29th, 2024, in Mohali, India, with Dr. Rao Tummala and other distinguished members of IESA officiating the inauguration ceremony.
Supported by ISM, SCL, IESA, IEEE Packaging Society, and ISSE, ISPEC aimed to drive India’s semiconductor, packaging, and systems research ambitions for sustainable design-led manufacturing.